Engineering Test Sockets (BGA,QFN,QFP,LGA)

 

G40 Grypper - High Performance BGA Socket

G40 Grypper - High Performance BGA Socket The G40 Grypper™ test socket for 0.4 mm – 0.65 mm pitch BGA devices delivers robust, cost effective solution for the most demanding engineering development, failure analysis and QA applications.

G80 Grypper - High Performance BGA Socket

G80 Grypper - High Performance BGA Socket Extending the reach of Grypper™ — the industry’s only solder-down, device footprint test socket technology — Cascade Microtech has developed its G80 Grypper as the superior test socket solution for high-ball-count BGA packaged devices.

Grypper - High Performance BGA Socket

Grypper - High Performance BGA Socket Our high performance Grypper BGA socket specifically addresses applications where the PCB holes for external fasteners and additional hardware simply cannot be accommodated. Sized the same as the device, the Grypper BGA socket is SMT soldered to the target PCB using conventional reflow methods. When it's time to populate for testing, the device can be quickly and easily snapped into the Grypper. Once inserted, the arms of the high-frequency contact firmly grip and cradle the solder ball, providing a solderless electrical connection.

High Performance BGA 65 Socket

High Performance BGA 65 Socket Cascade Microtech has developed BGA test sockets to specifically address the demanding high-performance signal integrity requirements for high-frequency component and system-level testing. These high-performance, compression-mount test sockets accommodate a wide range of standard and custom package sizes and I/O counts.

High Performance BGA 40 Socket

High Performance BGA 40 Socket Cascade Microtech has developed BGA test sockets to specifically address the demanding high-performance signal integrity requirements for high-frequency component and system-level testing. These high-performance, compression-mount test sockets accommodate a wide range of standard and custom package sizes and I/O counts.

QFP35 Test and Burn In Socket

QFP35 Test and Burn In Socket QFP35 test sockets are compression mount, low-cost, GHz performance designs that provide an alternative to higher priced, long-lead-time RF test sockets. Our socket designs are intended for peripherally leaded devices with integrated.

QFN35 Test and Burn In Socket

QFN35  Test and Burn In Socket High-performance QFN35 test sockets provide fast, cost-effective and reliable high-frequency component test and validation. For a fraction of the cost associated with ATE sockets, these low-cost, high-performance, compression-mount test sockets deliver superior signal integrity on the bench and in the oven.

LGA Test and Burn In Socket

LGA Test and Burn In Socket LGA test sockets are standardized, compression mount, High Frequency products. These test sockets are available for a wide range of standard and custom package sizes and I/O counts. They are specifically designed to address the demanding high performance signal integrity requirements for high frequency component and system level test.