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Probing 25 μm-diameter Micro-bumps for Wide-I/O 3D SICs

Direct micro-bump probing is proving to be a more cost-effective and technologically complete method than dedicated prebond probe pads. However, it requires advanced probe cards and probe stations. Recent work on test wafers has resulted in successfully probing single-channel wide-I/O micro-bumps at 25 μm diameter. Work continues to further prove out this methodology on actual Wide-I/O DRAM.

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Predicting end-of-life for future mobile devices

Each new generation of mobile devices demands increased capability without sacrificing reliability. Intrinsic semiconductor reliability evaluation enables designers to optimize both performance and quality. Learn how advanced test tools bring more sophisticated, reliable mobile products to market faster.

Learn more on our blog or Download Reprint

Working to Advance System-in-Package Miniaturization

Cascade Microtech’s CM300 on-wafer probe station was a vital part of the overall solution used in the SiP miniaturization efforts recently accomplished by Infineon Technologies. One of the key areas undergoing research is direct probing on fine-pitch micro-bumps that interconnect 3D-stacked dies. Both fine-pitch, low-force probe cards and a highly accurate prober are required. The combination of our Pyramid Probe® advanced technology and the accuracy of the CM300 deliver on these requirements

Learn more on our blog or Infineon's Press Release

New Calibration Solutions for Multi-Channel Probes using an Added Port for Thru Measurements

A new method is proposed for calibrating multichannel probes placed in multiple quadrants for wafer or chip level measurement. It uses an additional ground-signal-ground probe to enable thru measurements in a conventional calibration procedure, avoiding the need for custom calibration kits. The inherent delay inconsistencies in the proposed method are shown to be small enough to have minimal effects on the measurement uncertainties, in most practical cases.

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Consistent Parameter Extraction for Advanced RF Devices

Consistent Parameter Extraction for Advanced RF Devices

Pushing device operation frequencies towards the sub-THz range causes serious challenges for conventional device characterization techniques. This application note presents a comparison of SOLT, NIST multiline TRL, and LRRM probe-tip calibration methods for accuracy of measured and extracted figure of merits (FoM) of advanced BiCMOS HBT. A good understanding of possible sources of errors and potential room for improvement at each step are key to increasing the accuracy of device characterization. This paper will show why eLRRM is recommended as an accurate, consistent and easy to implement probe tip calibration method for characterization of advanced high-performance active devices.

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Please see this important announcement regarding Microsoft Windows XP.

Michael Burger, President and CEO, Cascade Microtech named 2014 Oregon Technology Executive of the Year

Michael Burger The Technology Association of Oregon (TAO) has selected Cascade Microtech CEO Michael Burger as the 2014 Technology Executive of the Year. Each year, members of the technology community choose an Executive of the Year in acknowledgement of the individual’s positive impact on the industry and the greater Oregon community. Under Michael’s leadership, Cascade Microtech has increased its footprint in critical areas of on-wafer probing to enable the semiconductor industry’s ongoing growth and vitality. Michael has been instrumental in transforming our company while delivering innovative solutions to critical customers on a global scale.

Cascade Microtech Featured on NASDAQ Tower

NASDAQ Tower - Times Square

We are honored to be featured on the NASDAQ Tower in Times Square as a result of our recent American Technology Award win for the APS200Tesla!

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Cascade Microtech Purchases ATT Advanced Temperature Test Systems GmbH

ATT Advanced Temperature Test Systems GmbH

ATT Systems will operate as a wholly-owned subsidiary offering high-performance thermal chucks for wafer probe systems. The most reliable temperature control systems for the semiconductor industry, ATT Systems’ products are designed for exceptional thermal and mechanical stability and precision.

View Press Release :: Visit ATT Systems' website

Cascade Microtech Acquires Aetrium’s Reliability Test Products Business

Reliability Test Products

The purchase strengthens the Company’s portfolio with package- and wafer-level reliability solutions for wafer process technologies. The acquisition is closely aligned with the Company’s strategy of delivering Integrated Measurement Solutions that address emerging requirements at advanced semiconductor nodes.

View Press Release :: New Products

Flexible 300 mm Probing Platform

CM300 Probe System Cascade Microtech’s CM300 is a flexible on-wafer measurement platform that scales to meet evolving needs in capability and automation. It enhances device and process characterization and modeling by capturing the true electrical performance of devices and enabling hands-off productivity. With the new Velox™ probe station control software, the CM300 enables safe and fast wafer loading and easy test automation and measurement system integration, while preventing damage of probe tips, probe cards and customer wafers throughout the entire measurement cycle. Read more ...

New Probe Quoting Tool Launched

Infinity Probe - on XpressQuote Cascade Microtech has recently launched XpressQuote, an online tool for RF probes. Locate the correct single- or dual-signal RF probe from a database of over 2,300 RF probes in the Cascade Microtech catalog, and receive pricing and quotes instantly.

XpressQuote - Try it Now