Cryogenic Probe Systems
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Unique Wafer-Level Probing down to 4 K
The cutting-edge is getting colder and superconducting materials are at the forefront of research. As semiconductor devices get smaller and new materials are used, the characteristics of these devices are not completely explained with the current theory. Therefore, much of the fundamental research undertaken today involves testing these new elements at cryogenic temperatures. These elements, including high electron mobility transistors (HEMT), infrared focal plane arrays, and superconductors, will likely become a part of next-generation devices.
Features and Benefits
- Test your devices at temperatures from 4 to 400 K
- Probing is as simple as on standard wafer-level probers
- Easy and ergonomic wafer handling with special substrate carriers
- Full range of accessories for a complete cryogenic testing solution
- Manual and semiautomatic versions available
Building off of the experience from the vacuum probe system, Cascade Microtech designed a unique cryogenic wafer-level probe system using a similar chamber concept, available as laboratory (PLC), manual (PMC) or semiautomatic (PAC) probe systems for testing wafers and substrates up to 300 mm.
Using a patented design, the cryogenic probe system is able to achieve temperatures down to 4 K. Furthermore, this cryogenic system can be built to function with a closed-loop cooling system. The process for cooling the chamber takes longer, but the system uses less liquid gas and therefore saves costs. A complete line of cryogenic-ready accessories, such as |Z| Probes®, calibration substrates, cables and probe positioners are available.