G80 Grypper - High Performance BGA Socket

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The G80 Grypper BGA test socket delivers substantial time and cost savings for the testing of 0.8mm+ pitch, higher-ball-count BGA packaged devices. It employs a unique contact design that significantly lowers the forces required to insert higher-ball-count BGA devices into the device-footprint G80 socket. The G80 Grypper solders directly to the device footprint and requires no socket lid, allowing increased utilization of development and FA boards that traditionally have limited life due to the soldering and de-soldering of devices. Eliminating special test boards and decreasing the amount of boards used through development typically increases utilization by a factor of five, reducing overall test cost to IC developers and manufacturers.

G80 Grypper : Device Foot Print 0.8mm+ Pitch BGA Test Sockets
Features	G80 Grypper
Contact pitches available from 0.8mm+ Targeted for BGA packages with > 200 solder balls Low insertion loss up to 20 GHz Current rating of 1 A per contact Rated for 50-100 insertions No socket lid required	G80 Grypper Datasheet