SUSS Test Products / ProbeShield® Technology
 

PA300 ProbeShield 3D

Features and Benefits

  • Probing on small pads and targets down to 25µm
  • Unique automated probe-to-pad alignment with vertical probe cards
  • ProbeShield® technology for most accurate low level measurements
  • ReAlign™ technology for unattended, automatic re-alignment of the system after temperature changes
  • Optimum visualization of all ongoing tasks in all 3 dimensions by ContactView™ and iVista™

The SUSS MicroTec PA300PS 3D is the worlds first probe station for electrical probing of 3D stacked structures on wafer level. Many different engineering and monitoring tests after wafer production as well as before the next stacking steps or final packaging can be addressed with this flexible tool.

The PA300PS 3D incorporates SUSS MicroTec's unique technologies MicroAlign™, Automated Thermal Management (ATM™), ReAlign™ and ProbeShield®. This allows tests in a wide temperature range, collecting low signal data in an EMI-shielded environment using high pin count vertical probe cards and furthermore enabling damage free probing of small test pads to avoid influences of the pad probe marks to further bonding steps. The improved z-theta chuck stage assembly provides micrometer resolution in combination with increased thermal and mechanical stability for highest accuracy, lowest drift and maximum stiffness at high probe forces by the unique z-axis wedge design. The thermal chuck system provides the highest planarity and fastest temperature transmission time on the market for maximum test affectivity and perfect system planarity in combination with the adjustable probe card levelling. The unique ContactView™ and iVista™ microscope are providing permanently optimum visualization of all ongoing tasks in all 3 dimensions for maximum operations safety and effectively.