SUSS Test Products
 

ProbeShield® Technology

The Ultimate Tool for Device Characterization and Modeling, Process Control, Reliability Test, Failure Analysis and 3D IC Engineering Test

Product Highlights

  • More efficient model extraction with highly accurate I-V, C-V, flicker noise (1/f) and S-parameter measurements
  • Automated generation of modeling and reliability data thanks to intelligent system design and advanced software tools
  • Integration of measurement equipment inside the ProbeShield® system reduces capital outlay and increases accuracy
  • Fine-pitch probing on small pads with precise positioning system and optional MicroAlign™ Technology
  • Easy, safe and ergonomic operation

ProbeShield® Technology creates a measurement environment free from electromagnetic (EMI) and radio-frequency interference (RFI) for device characterization and modeling, process development, wafer-level reliability and failure analysis and 3D IC engineering test.

ProbeShield® Technology enhances your device and process development, reducing feedback times and design iterations to gain the efficiencies needed for a faster time to market and higher return on investment. This can only be accomplished with ProbeShield Technology's superior measurement accuracy, precise positioning accuracy and intelligent hardware and software systems, which eliminate wasted time and costly errors.

Cascade Microtech now offers the PA300PS 3D, the worlds first probe station for electrical probing of 3D stacked structures on wafer level.

 

PA300 ProbeShield 3D

PA300 ProbeShield 3D The PA300PS 3D is the worlds first probe station for electrical probing of 3D stacked structures on wafer level. Many different engineering and monitoring tests after wafer production as well as before the next stacking steps or final packaging can be addressed with this flexible tool.