Dedicated Probe Systems
SUSS has designed solutions that are dedicated to specific test applications or testing specific devices. Although these solutions are dedicated, they retain the flexibility and modularity that every SUSS probe station offers. SUSS has dedicated solutions for wafer-level reliability (WLR) testing, MEMS testing and materials research as well as for failure analysis (especially emission microscopy).Wafer-Level Reliability
With shrinking device geometries, and increasingly complex designs, capturing high quality measurement data is challenging. Wafer Level Reliability requires a low-noise environment capable of handling a large temperature range. Cascade Microtech offers a full portfolio of manual and semi-automatic 200mm and 300mm systems with temperature capability for -55°C to 400°C and support for a broad range of probe cards.
Vacuum Probe Systems
More and more MEMS devices today require vacuums to operate, such as RF MEMS, resonators and microbolometers, or must operate in near vacuums such as in space. Testing these devices has been done generally after they are packaged – a very expensive process that accounts for 60 - 80 percent of the total cost of the device
Cryogenic Probe Systems
The cutting-edge is getting colder. Superconducting materials are at the forefront of research, and as semiconductor devices get smaller new materials are used, the characteristics of these devices are not completely explained with the current theory. Therefore, much of the fundamental research undertaken today involves testing these new elements at cryogenic temperatures. These elements, including high electron mobility transistors (HEMT), infrared focal plane arrays, and superconductors, will likely become a part of next-generation devices.
Pressure Probe Systems
The pressure probe systems, PAP200LP and PAP200HP enable testing of pressure sensors and any devices that may need to operate in a different gas atmosphere or at a different humidity. Instead of packaging the device and then testing for bad dies, the pressure probe system tests at wafer level before packaging. This reduces manufacturing costs and time to market.
Double Side Probe Systems
The patented Double Side Probe Systems (DSP) are the technology leaders for all applications requiring access from both the top and back side of the wafer. Working in close cooperation with the leading suppliers of emission microscopes, Cascade Microtech has developed systems are an invaluable tool for defect localization in design verification and failure analysis when the DUT has multiple layers of metallization, flip-chip or lead-on-chip packaging.
Backside Emission Probe Systems
Backside Emission Probe Systems are designed for probing different substrates by contacting the device under test (DUT) with needles from the contact side (top side) and inspect or stimulate the backside (bottom side) with an emission detection unit. The probers are compatible with all bottom-up observation systems from all major vendors.
THP100 Test Head Probe System
To enable analytical tests of fully functional devices, Cascade Microtech offers a truly portable probing platform that docks onto test heads from all leading vendors. This concept eliminates cabled interfaces between the probe system and the tester, making at-speed testing on a flexible analytical probe station possible.
