Grypper - High Performance BGA Socket

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Gryphics - BGA GrypperOur high performance Grypper BGA socket specifically addresses applications where the PCB holes for external fasteners and additional hardware simply cannot be accommodated.  Sized the same as the device, the Grypper BGA socket is SMT soldered to the target PCB using conventional reflow methods.  When it's time to populate for testing, the device can be quickly and easily snapped into the Grypper.  Once inserted, the arms of the high-frequency contact firmly grip and cradle the solder ball, providing a solderless electrical connection.

Grypper: Device Footprint 0.65mm+ Pitch BGA Test Sockets
FeaturesGrypper: 0.65mm+ pitch
  • Contact pitches available from 0.65mm+
  • Targeted for BGA packages with < 200 solder balls
  • Lowinsertion loss up to 20 GHz
  • Current rating of 2.5 A per contact
  • SMT solder mounted - Same process as BGA device
  • Rated for 100 insertions
  • No socket lid required
Gryphics - BGA 65 Datasheet Cover
Grypper Datasheet