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Wafer-Level Reliability

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With shrinking device geometries and increasingly complex designs, capturing high quality measurement data is challenging. Wafer Level Reliability requires a low-noise environment capable of handling a large temperature range. Cascade Microtech offers a full portfolio of manual and semi-automatic 200 mm and 300 mm systems with a temperature capability from -55°C to 400°C and support for a broad range of probe cards.

PM8WLR

PM8WLR

Developed to meet the critical needs of 90 nm or smaller process technologies used by semiconductor manufacturers, the PM8WLR probe system provides long-term process reliability measurements at temperatures up to 300°C. Multi-site probe cards can be easily integrated with the probe station and reduce test times to a minimum. Therefore, you have more reliability data for design and process improvement much faster than when testing packaged devices. Additionally, reliability testing before the packaging process eliminates significant costs. [View more]

PM300WLR

PM300WLR

The PM300WLR is the only dedicated probe system for wafer-level reliability (WLR) testing of substrates up to 300 mm. The PM300WLR provides quick, accurate results before the device is packaged. This means critical reliability information for design and process improvement is delivered faster and at significantly lower costs than with traditional testing of packaged devices. [View more]