Summit Semi-automatic Probe System
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Related Files
- Summit Data Sheet
- Summit System Highlights
- Summit 11000/12000 Facility Planning Guide
- ESPEC ETC-200L Thermal System for Summit (-65 to +200°C) Facility Planning Guide
- ERS AirCool Plus Thermal System for Summit (-55 to +200°C and -55 to +300°C) Facility Planning Guide
- ERS AirCool Thermal System for Summit (+20 to +300°C) Facility Planning Guide
- VueTrack technology for unattended testing over multiple temperatures
- Wafer-level reliability measurements speed your time to accurate results
Precise On-Wafer Device and Process Characterization
The Summit series semi-automatic probe systems, with PureLine™ and AttoGuard® technologies, allow you to access the full range of your test instruments for wafers up to 200 mm. Whatever your application: RF/Microwave, device characterization, wafer-level reliability, e-test, modeling or yield enhancement, the Summit leads the industry in on-wafer measurements. Summit series probe systems are easy to configure with your choice of measurement performance, chuck size, thermal range and microscope options. All platforms are -60°C to 300°C compatible to ensure an upgrade path to meet your future needs. Cascade Microtech provides many accessories for the Summit for a wide range of applications to suit your unique wafer probing test needs.
Features and Benefits
- High-precision wafer probe station for device characterization and modeling
- Re-configurable for multiple applications: DC, RF, mmW, FA, WLR and more
- Excellent EMI shielding for low noise measurement
- Wide range of temperature options from -60 to 300°C and higher
