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Probe Systems Planning
Optimized Systems solve complex measurement challenges
Integrated systems from Cascade Microtech provide a complete solution for complex measurement problems that cannot be solved with just a collection of piece parts. Each part of the integrated solution is optimized and fine tuned to work together, enabling fast accurate on-wafer data collection for complex application and measurement needs. Integrated Systems are build upon high performance Cascade Microtech probe stations, giving you the ease of use and full featured on-wafer probing experience that has made Cascade Probe Station's the #1 choice of customer throughout the world. And each turnkey solution includes everything you need in one system, including a variety of highly optimized on-wafer probes, test instrumentation & cabling configurations, and software tools, ready to go.
EDGE 1/f Noise Measurement Solution
The EDGE™ is the world's first and only measurement solution that delivers accurate 1/f (flicker) noise measurements from 1 Hz up to 40 MHz. The EDGE delivers new levels of certainty to companies that must continue to improve device performance, increase yield, command higher margins and reduce time to market. [View more]
Tesla Power Device Characterization System
Now power device manufacturers can take advantage of a complete on-wafer solution for over temperature, low-contact resistance measurements of power devices up to 3,000 V (triax)/10,000 V (coax). Tesla is here to help power device manufacturers meet and beat the extraordinary pace of the global marketplace. [View more]
Wafer-Level Reliability
With shrinking device geometries and increasingly complex designs, capturing high quality measurement data is challenging. Wafer Level Reliability requires a low-noise environment capable of handling a large temperature range. Cascade Microtech offers a full portfolio of manual and semi-automatic 200 mm and 300 mm systems with a temperature capability from -55°C to 400°C and support for a broad range of probe cards. [View more]
Vacuum Probe Systems
Today, more and more MEMS devices require vacuums to operate, such as RF MEMS, resonators and microbolometers, or the devices must operate in near vacuums such as in space. Testing these devices has been done generally after they are packaged – a very expensive process that accounts for 60 to 80 percent of the total cost of the device. [View more]
Cryogenic Probe Systems
The cutting-edge is getting colder and superconducting materials are at the forefront of research. As semiconductor devices get smaller and new materials are used, the characteristics of these devices are not completely explained with the current theory. Therefore, much of the fundamental research undertaken today involves testing these new elements at cryogenic temperatures. These elements, including high electron mobility transistors (HEMT), infrared focal plane arrays, and superconductors, will likely become a part of next-generation devices. [View more]
Pressure Probe Systems
The pressure probe systems, PAP200LP and PAP200HP enable testing of pressure sensors and any devices that may need to operate in a different gas atmosphere or at a different humidity. Instead of packaging the device and then testing for bad dies, the pressure probe system tests at wafer level before packaging. This reduces manufacturing costs and time to market. [View more]
Double Side Probe Systems
The patented Double Side Probe Systems (DSP) are the technology leaders for all applications requiring access from both the top and back side of the wafer. Working in close cooperation with the leading suppliers of emission microscopes, Cascade Microtech has developed systems that are invaluable for defect localization in design verification and failure analysis when the DUT has multiple layers of metallization, flip-chip or lead-on-chip packaging. [View more]
CP200-X Series Cluster Probe System
The Cluster Probe System is a revolutionary new method for wafer-level functional testing in a production environment.
Cluster Production Test System
Wafer size: ≤ 200mm
Main Applications: DCM, PT [View more]
Backside Emission Probe Systems
Backside Emission Probe Systems are designed for probing different substrates by contacting the device under test (DUT) with needles from the contact side (top side) and inspecting or stimulating the backside (bottom side) with an emission detection unit. The probers are compatible with all bottom-up observation systems from all major vendors. [View more]
THP100 Test Head Probe System
To enable analytical tests of fully functional devices, Cascade Microtech offers a truly portable probing platform that docks onto test heads from all leading vendors. This concept eliminates cabled interfaces between the probe system and the tester, making at-speed testing on a flexible analytical probe station possible. [View more]
Board Test Probe Stations
Cascade Microtech offers affordable and complete horizontal and vertical board test systems, enabling precision electrical measurements of IC packages and circuit boards. [View more]

