Pyramid Probe Cards operate in numerous combinations of automated wafer probe and automated test equipment (ATE) environments. These environments typically include an ATE tester with docking head, a prober, and an interface module with several components.

The primary function of the interface module is to provide a continuous, distortion-free electrical signal path from the pads or bumps on the wafer to the electronics of the ATE. To do so, components of the interface module must be designed with several minimum and maximum mechanical dimensions in mind. For instance, the spring-pins in the ring must contact the tester side of the probe card. At the same time, the probe tips must clear any support structure underneath the card and make contact with the wafer surface. The prober has a range of motion in the z-axis. The probe tips must be within this range including offsets for wafer thickness, over drive, and mechanical tolerances.

Critical dimensions within the interface module include:

• Thickness of probe card
• Range of acceptable probe depth
• Additional tolerances for on-line cleaning

These values are influenced by the thickness of the carrier ring, the thickness of the wafer, the range of the chuck’s z-axis travel.  When ordering a Pyramid Probe card, have these dimensions available for your particular environment. Cascade Microtech engineers will then design a solution to meet your needs.