SiP/SoC P-Series Pyramid Probe cards reduce your cost of ownership through enhanced throughput, reduced maintenance and increased yields - enabled by large multi-DUT probe surfaces, permanent probe alignment, superior electrical performance and long life. Designed for both bond-pad and flip-chip bump applications, the SiP/SoC P-Series allows at-speed testing of large-scale ICs at die sort. Low inductance power, ground contacts and controlled impedance signal lines provide electrical performance exceeding most IC packages. At-speed die sort reduces scrap and allows shipment of KGD.

Features

• High-bandwidth microstrip transmission lines to probe tips guarantee performance and ensure low signal loss.
• Consistent low contact resistance and low-inductance probe tips ensure accurate and repeatable high-speed digital and analog measurements.
• Low maintenance and permanent probe tip placement improve test cell uptime, reducing the cost of ownership.