Failure Analysis/Design Debug

Multi purpose analysis of the smallest features - on-wafer or in package

Viewing and making electrical contact to sub-micron internal IC circuit features can be challenging. Mechanical stability and precision, flexible and easy application changeover coupled with precision electrical measurement capability, make Cascade systems the right choice for failure analysis.

Measurement/TechnologyApplication NeedSolution

IC or memory design debug

Internal node test with IC powered up, IC timing analysis, signal verification, localized deprocessing, FIB pad probing

Ultra Stable Probe System,   laser cutter, high impedance probes, CAD navigation, vibration isolation, probe card holder

Sub-micron probing

High impedance probing, viewing and probing <0.25 µm features, DC testing, localized deprocessing, FIB pad probing

Rigid/stable system, high impedance probe, laser, CAD navigation, vibration isolation

Emission microscopy

IR spectrum, thermal analysis, thinned wafer support, backside probing, interface to CAD navigation software

Ultra Stable Probe System, CAD navigation, vibration isolation

Internal node probing

High impedance probing, passivation removal, metal cutting, low load and high bandwidth measurements, catch one time and spurious events, localized deprocessing, FIB pad probing

Rigid/stable system, high impedance probe, laser, CAD navigation, vibration isolation

 

 

 

Package test

Discrete component/PCB testing

Rigid/stable Probe System, Stage PCB clamp