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Application Notes
Wafer-level reliability measurements speed your time to accurate results
IC device and process reliability have always been highly dependent on a thorough understanding of the underlying reliability physics. Today, new materials and shrinking device geometries are compounding the challenges of achieving fast and accurate reliability data. Advanced semiconductor processes have aggressively scaled devices with ultra-thin gate dielectrics, high-k materials and shorter channel lengths.
Making Accurate and Reliable 4-port On-Wafer Measurement
This application note will cover what you need to know to be successful when making on-wafer RF measurements on 4-port devices. It addresses the most common problems encountered related to measurement and calibration and shows how they can be solved using Cascade Microtech’s dual wafer probes, calibration impedance standards, and new advanced hybrid calibration methods that minimize undesirable side-effects.
VNA Calset Port Augmentation for Impedance Matching Probe Calibration
A method for calibrating an on-wafer VNA measurement system with unequal port impedances determined by impedance matching probes is presented. The method starts with an existing stored calibration set for measurement reference planes at the ends of the coaxial cables. A new calibration set with a probe-tip reference plane is determined through a calibration set augmentation procedure using measured two-port normalized S-parameters of each probe.
Validation of On-Wafer Vector Network Analyzer Systems
The case study described in this paper applies a known vector network analyzer comparison technique to an onwafer
measurement environment. The purpose is to investigate and expand upon this technique’s applicability for use in
validating an on-wafer VNA system of unknown accuracy by comparing it to an on-wafer VNA system of trusted accuracy.
The technique involves taking calibrated S-Parameter measurements with each system over a set of validation devices
and calculating the measurement differences betw
A Hybrid Probe-Tip Calibration for Multiport Vector Network Analyzers
This paper details the first commercial implementation of a hybrid multiport vector network analyzer (VNA) calibration method suited to a probing environment. The new calibration method implements the enhanced Line-Reflect-Reflect-Match with automatic determination of load inductance for a number of straight thru paths to fully determine all directivity, reflection tracking, and source and load match terms as well as the associated transmission tracking terms. The remaining transmission tracking terms are f
Reduce thermal soak time during over-temperature device characterization with the eVue Digital Imaging System
With smaller pad sizes becoming more common, there is an increased need for probe positioning accuracy during wafer test to ensure accurate test data. In order to increase accuracy for small pad probing, accurate Z height control becomes critical to avoiding errors caused by wafer height variations for ambient and over-temperature on-wafer testing. This paper presents Cascade Microtech's solution to this issue usingw afer profiling and dynamic Z-height control during thermal probing,
eVue Backgrounder
Cascade Microtech's eVue digital imaging system is a revolutionary new microscopy tool optimized for on-wafer test with Cascade Microtech Probe Stations. eVue offers enhanced high-definition video, superior navigation and excellent accuracy for viewing and profiling a device under test. The eVue digital imaging system allows users to navigate, observe, and measure devices without the need for a conventional microscope. It combines new wafer probe navigation tools with next generation digital microcope techn
Recent Advances in DC Parametric Measurements
New technologies used by semiconductor parametric analytical and automatic wafer probers to reduce residual system capacitance and noise levels and to increase measurement speed will be discussed. Methods to ensure fast, accurate ultra-low-level measurements (femtoamp and femtofarad) over-temperature (-65 to 300°C) will also be discussed.
Improved CV and IV Thermal Measurement Capabilities Using the Patented AttoGuard
Since 1993, engineers tasked with producing accurate device models or maintaining process control have enjoyed the ultra-low fF level capacitance and fA level current measurement capabilities of our room temperature, MicroChamber® probers with the AttoGuardTM.
Alignment of Laser Head on Alessi Failure Analysis Stations
The purpose of this technical brief is to show how easy it is to externally align a laser on an Alessi Failure Analysis Probe Station. The laser is already aligned internally at the factory. The output beam is aligned to exit the center of the aperture and run along the axial path of the optical system. No internal adjustment inside the laser is necessary.
PureLine Modeling Tech Brief
Some measured parameters are highly susceptible to spurious electrical noise that impinges on a wafer device. Example affected measurements are Vth & Id, gm, several capacitance parameters, and of course flicker noise. The offenders may be radiated or conducted emissions from external sources or locally gener-ated emissions. Improvements in isolation, shielding, power supplies and filters of on-wafer systems have been recently initiated that enhance measurement accuracy, ease and speed. This presentation sh
A Guide to Better Vector Network Analyzer Calibrations for Probe Tip Measurements
Calibrating VNA with standards at probe tips allows removal of repeatable errors from the VNA, cable, and probe losses and reflections. Accurate calibrations require careful attention to the calibration method and elements used, probe tip physical placement accuracy, and system repeatability.
Vector Network Analyzer calibration with the Surrogate Chip Kit
High-Frequency, Over-Temperature Measurements
Recent advances in thermal probing equipment have reduced the cost of obtaining temperature-dependent S-parameter data, while increasing throughput capabilities. This paper presents the calibration methods and measurement considerations of high-frequency, over-temperature measurements (-65 to 200C).
Reducing Measurement Noise In Thermal Wafer Probing Systems
The trend toward increasing IC density has led to the use of accelerated at-temperature wafer-reliability testing to determine time-to-failure. In device modeling, these tests provide information on semiconductor device behavior over an extended temperature range, assuring more accurate designs and models. Wafer-probing systems with hot/cold chucks are now in common use. But many users find inherent limitations in today’s standard thermal probing stations that limit measurement capability.
Cryogenic On-Wafer Measurement Techniques to 18K
This paper identifies key issues related to cryogenic measurements and demonstrates that with Cascade`s probes and ISS, the accuracy and repeatability of cryogenic calibrations can be comparable to room temperature calibrations.
The Importance of Chuck Guarding in Top of Wafer Measurements
Previously difficult measurements, such as gate overlap capacitance or sub-threshold current of submicron devices, became reliable and repeatable with these patented prober technologies. This Technical Brief introduces the performance benefits of the Summit 12861 MicroChamber®, thermal prober with AttoGuardTM.
High-Frequency, Over-Temperature Measurements and Modeling
An overview of the ECP (Equivalent Circuit Parameter) extraction method, thermal probing system configuration, calibration considerations, and measurement issues is presented. General extraction results are shown for MESFET, PHEMT, and HBT devices.
Achieving High-Accuracy On-Wafer Capacitance Measurements
On-wafer capacitance measurements are critical for high-yield processes and accurate device models. With smaller device geometries, the characterization of extrinsic device capacitance has taken on increased significance. Accurate measurement techniques are critical for accurate capacitance characterizations.
Evaluating Thin Gate Oxides: A Guide to Better Measurements
Evaluation and characterization of increasingly thin insulating gate oxides is important in assuring the reliability of MOS VLSI technology. Commonly used evaluation techniques include the time-zero-breakdown (TZB) test, and time-dependent dielectric breakdown (TDB) test.
Technique Verifies LRRM Calibrations on GaAs Substrates
Cascade Microtech demonstrated the outstanding accuracy and repeatability of automated LRRM calibrations with load-inductance compensation compared with NIST`s benchmark.
Hot Electron Degradation in BJTs: Techniques for Improved Measurements
Bipolar device scaling and operating conditions often produce high electric fields, causing reverse-bias stress on the emitter-base junction. This degradation results from hot carriers at the junction due to the large electric field. Hot-carrier damage can occur even at low base-emitter reverse-bias conditions and has become an important reliability consideration in predicting device lifetime. The degree of acceptable degradation is both device- and circuit- dependent.
MCM Test Point Design Rules
This paper provides information on mechanical and electric layout “rules” and GHz microprobes. This knowledge will help you achieve the best possible characterization and tests of your modules. Specific device applications include MCMs, Characterization structures, Hybrids and Packages.
M150 Measurement Platform Backgrounder
For the First Time: High Performance Precision Electrical Measurement for Any Type of 150mm Device on One Platform
PureLine Technology Backgrounder
PureLine wafer probing systems have the features required for superior on-wafer measurement capability in such applications as device characterization
and modeling, wafer-level reliability and yield enhancement. PureLine systems include the MicroChamber shielded wafer enclosure for reduced EMI and RFI interference, AttoGuard
active guard for reduced stray capacitance and noise reduction, low-noise triaxial thermal chucks for suppressed noise injection, and low impedance grounds for improved bypass of broa
Recommended Procedures for using Probe Scrub PN 134-210 Cleaning Materials
Recommended Procedures for using Probe Clean PN 134-208 Cleaning Materials
Probe Clean™ (PN 134-208) is designed
specifically to remove and collect loose debris generated during probing. The cleaning material has an effective operating temperature range of -50º C to +200º C. It is not designed to remove embedded or bonded debris.
A Comparison of PCS and Nucleus 2.1 software Features to Ensure an Easy Upgrade
Nucleus 2.1 software package gives you productivity enhancements that save time and money from the moment you upgrade. Nucleus replaces PCS on all new Summit 12000-series and S300-series probing stations from Cascade Microtech. This document outlines compatibilities between Nucleus 2.1 and PCS 2.6.
Comparison of Nucleus 2.5 and Galaxy 5.20h
Nucleus 2.5 Software replaces Galaxy on Alessi 6100 series probing stations. The Nucleus design is based on Cascade’s long experience with prober control software and extends that experience with new productivity enhancements that make your test
job easier and faster. This document compares Nucleus and Galaxy, showing how
to take advantage of the many new features that have been added in Nucleus.
On Wafer Vector Network Analyzer Calibration & Measurements
The Vector Network Analyzer or VNA has become the workhorse of most network measurements above 1 GHz. Getting the best on-wafer measurement results requires a solid understanding of measurement system components and their interaction. This application note is intended to introduce on-wafer vector measurements and provide references for further study.
Sensitivity Analysis of Calibration Standards for SOLT and LRRM
We investigate the sensitivity of SOLT and LRRM on wafer calibrations to probe
positioning. Calibration comparison derived error-bounds were calculated for data sets
differing only by a single change in probe/standard overlap. The SOLT calibration was found
to be significantly more sensitive to probe placement variations, consistent with theoretical
predictions.
Microprobing with the HP54750 Oscilloscope
A guide to making accurate measurements with the HP 54750 Digitizing Oscilloscope and Time Domain Reflectometer using Cascade Microtech high frequency probes.
Accurate Measurement of High-Speed Package and Interconnect Parasitics
Accurate characterization of package and Interconnect parasitics is necessary for predictable subnanosecond performance of high-speed IC designs. A means of probing small structures for high-speed characteristics is described.
Planar Impedance Standards and Considerations in Vector Network Analysis
An equation is given for theoretical errors in one-port corrected vector S-parameter measurements. The error analysis is used to investigate parasitics peculiar to planar impedance standards. Experimental results show that parasitics as small as 5pH are repeatable measurable. Application to GaAsFET measurements through 26GHz is discussed.
Layout Rules for WPH-900 Series Probes
Cascade Microtech WPH-900 series probes are designed for supplying bias voltages, controlling signals and other low frequency uses. The WPH-900 series probes are intended to work in conjunction with Cascade Microtech coplanar GHz probes.
Layout Rules for GHz Probing
Coplanar GHz probes have been available only since 1983, and have significantly advanced wafer probing capabilities. Wafer probing at GHz frequencies has developed over the past several years from a simple R&D toy to a sophisticated high-volume manufacturing tool used in GaAs, silicon, packaging, and hybrid industries.
Successful GHz probing requires that consideration be given to layout and design before design completion and mask fabrication. Failure to observe specific layout
requirements can result in
High-speed digital IC package characterization, using microwave probing and fixturing techniques
Techniques to fixture and accurately measure the high-frequency characteristics of digital IC packages are described. Microwave wafer probes are used to accurately measure a 169-pin PGA through the use of a special interface fixture that adapts the package to microwave probe requirements.
Microprobing with the Fine-Pitch Active Probe
The current trends in surface mount, module, and interconnect technologies predict that standard surface mount pitches will soon become as small as 10 mils. Present technologies already use 20 or 25 mil pitches, which present significant probing difficulties even for the experienced user. New problems brought on by increased speed/performance and by decreased pitches make traditional handheld oscilloscope probes unwieldy. Cascade Microtech provides a solution to these problems with the introduction of the F
Benefits of Using the New Infinity Probe on Devices with Gold or Aluminum Probe Pads
The new Cascade Microtech Infinity Probe utilizes Cascade’s proprietary lithographic
thin-film technology. This technology allows the use of a microstrip
transmission line to transmit the signal to the device under test.
Introduction to bipolar device GHz measurement techniques
This application note describes on-wafer techniques for accurately measuring small high-speed silicon bipolar devices, including techniques to correct for pad parasitics. Most of these procedures are applicable to measuring large devices as well.
High Speed Digital Microprobing
The silicon digital integrated circuit (IC) industry is now poised on the edge of a major transition. The inexorable increase in speed brings unexpected problems related to high frequency operation. Edge rates of 0.5 nanoseconds off die, and 100 picoseconds on die are now common. What is unexpected is that digital ICs are affected by the same phenomena as microwave engineers are experiencing: ground plane resonances, skin effect, and antenna effects, to name a few. These phenomena, while difficult to model
Develop a More Accurate MMIC Design Database
This paper describes new techniques for verifying on-wafer microwave calibrations and measurements, quickly and automatically extracting FET equivalent circuits, and utilizing the resulting data. One of the findings of the FET modeling work is that a GaAsFET`s parasitic drain resistance appears to go negative at larger drain bias voltages.
On-Wafer Measurements with the HP8510 Network Analyzer and Cascade Microtech Wafer Probes
This paper presents a system, consisting of HP8510 network analyzer and wafer probes, that is used to make RF measurements of microwave devices and IC`s (MMIC`s) directly on-wafer. The configuration of the system and characteristics of wafer probes are described. Techniques for making the best possible on-wafer measurements are also addressed, and a range of on-wafer measurement applications will be examined.
40 GHz On-Wafer Measurements with the HP 8510 Network Analyzer and Cascade Microtech Wafer Probes
This paper presents a system, consisting of HP8510 network analyzer and wafer probes, that is used to make RF measurements of microwave devices and Ics (MMICs) directly on-wafer for frequencies up to 40GHz. The configuration of the system and the characteristics of the wafer probes are described, and calibration methods will be covered.
Microprobing Essentials for Fine-Pitch Modules
Today’s new fine pitch surface mount technology (SMT) packages and multichip modules (MCMs) limit the usefulness of traditional handheld probes. At higher speeds, the problems can be electrical, but in general the limitations are mechanical. Just how do I electrically probe a fine pitch SMT device? With SMT pitches commonly 0.5 mm (20 mils) and 0.25-0.38 mm (10-15 mils) pitches soon, probing presents a serious problem for all users and manufacturers of SMT products.
Flexible, multi-application probing solution in 150mm wafer enviroments
The challenge of deploying cost-effective probing solutions has become a
key issue due to the increasing diversity of applications being implemented
on 150-mm wafers. The probing solutions must accommodate a variety
of application-specifi c processes and multidiscipline technologies without
compromising precise measurements. Accordingly, the need for precision
measurement must be combined with confi gurability and adaptability of the
probing platform while remaining cost effective.
On-wafer Multiport/Differential Calibration using the Agilent ENA Series Network Analyzer with Cascade Microtech Probing Solution
Combining the Agilent's ENA Series Network Analyzer with Cascade Microtech's probing solution (Air Coplanar probes (ACP), ENA WaferCal software, new dedicated Dual/Differential ISS's) you can evaluate on-wafer multiport/differential devices and components accurately.
Summit Labview Integration Toolkit
The Summit LabVIEW Integration Toolkit was developed to help test engineers quickly and easily get their LabVIEW test programs "up and running" with Cascade Microtech Summit semi-automatic probe stations. The Toolkit was joint-ly developed between Cascade Microtech and Microsys Technologies Inc., and includes a LabVIEW prober driver, 3 example programs (including source code VI’s), manual and full online help.
Microprobing with the MTS-2200 Fine-Pitch Probing System
The MTS-2000 Fine Pitch Microprobing System fills the void between analytical microprobe stations and handheld probes. People involved in multichip module (MCM), surface mount (SMT), and other hybrid technologies will appreciate the system’s 1 –mil positioning capabilities, as well as the sub-30 ps, 18 GHz electrical performance. Rather than using large handheld probes, the MTS-2200 system uses very small microprobes with independently positioned ground contacts. Instead of a long ground wire, these fine pi
A Probe Technology for 110+ GHz Integrated Circuits w/Aluminum Pads
Wafer probes for aluminum pads with 110 GHz performance and low repeatable contact resistance are demonstrated. These probes are based on an existing membrane probe card technology that routinely achieves less than 0.2 ohms contact resistance in production environments.
Advanced On-Wafer Device Characterization Using the Summit 10500
Today’s emerging technologies require a higher degree of device characterization than ever before. This application note provides information on how the Summit 10500 Parametric Probe Station enables state-of-the-art DC/CV, LCZ, and high-frequency measurements at fA-, fF-, and GHz-levels. The Summit 10500 is the first integrated on-wafer measurement system for fundamental characterization tasks.
Enable dramatic productivity gains in device characterization and probing with new probe navigation tool
Trends in the semiconductor industry are heading towards higher densities and increasing comprexities and are forcing continuing reductions in pad size and pitch on wafers. This in turn makes the ability to accurately align probe cards more challenging. This paper presents Cascade Microtech's solution to this issue through the ability to view multiple perspectives of the device under test, which radically improves navigation speed and accuracy.
Wafer Probing System Parametric Evaluation Files
Cascade Microtech has found several electrical tests quite useful for assessing
the parametric measurement capability of a wafer probing system. These system
evaluation tests can be executed using the industry standard Agilent 4156B/C
series DC Parameter Analyzer. 4156 instrument setup files(.dat files) are available from Cascade Microtech on a 4156 readable floppy disk.
Microprobing with the HP54121T Oscilloscope
A guide to making accurate measurements
with the HP 54121T Digitizing Oscilloscope and Time Domain Reflectometer, using Cascade Microtech high-frequency probes.
On-Wafer Temperature Testing with the Summit 10600 Thermal Probing System
This user’s guide describes techniques for accurately characterizing high-frequency devices and circuits over temperature. Guidelines for using the Summit 10600 Thermal Probing System (patents pending) to obtain 1% accuracy measurements are also presented.
Accuracy Factors in Microwave Noise Parameter Measurements
Factors contributing to microwave noise parameter measurement accuracy are examined theoretically and experimentally. It is shown that the test source impedances needn't be grouped around the impedance for minimun noise. Calibration and DUT S-parameter accuracy is shown to be important to the noise parameter accuracy. A new algorithm has been implemented which corrects for different noise source "on" and "off" impedances.
On-Wafer Multiport Calibration Using the ENA Series Network Analyzer with CMI Probe System
On-Wafer Multiport Calibration Using the ENA Series Network Analyzer with CMI Probe System App Note
On-wafer Balanced Measurements using the ENA Series Network Analyzer with CMI Probe System
On-wafer Balanced Measurements using the ENA Series Network Analyzer with CMI Probe System App Note
Proper Infinity Probe Alignment on Various ISSs
Proper Infinity Probe Alignment on Various ISSs
Photodiode/VCSEL Production Characterization System
Reducing the cost of test, increasing throughput, and improving yield are the primary focuses for Photonic device production companies. To assist photonic device manufacturing customers with these challenges, Cascade Microtech and Cottonwood Technology Group, Inc. (CTGi)have partnered to create a complete measurement solution for on-wafer production photodiode and VCSEL test. The system, based on a Summit 12000 Series probe station from Cascade with measurement and test data management software from CTGi, a
Recommended Procedures for using Probe Polish PN 134-209 Cleaning Materials
Improvements to the Accuracy of On-Wafer Noise Characterization, Using a Vector Network Analyzer
Difficulties in finding the noise parameters of an active linear two-port have been eased somewhat by the introduction of noise characterization systems which not only speed the measurement process, but allow use of error correction algorithms to reduce measurement errors. Error sources have been identified, and computer simulations of the effects of residual measurement errors on the predicted noise parameters indicate which features of a measurement system are important.
Configuring a Precision System for On-Wafer Capacitance
For highly repeatable, high accuracy CV measurements and to reach the full
potential of the new high frequency LCR/Z instruments, a new system approach
with new accessories is needed. Cascade Microtech, the innovator and leader in
high frequency probing systems, offers a very practical and complete probing
solution specifically designed to support precision CV measurements to
110 MHz.
Low-Level DC Parametric Measurements for Process Device Characterization
Ever-shrinking semiconductor device dimensions have necessitated reductions in power dissipation and signal levels. Characterization and reliability assessments of sub-micron devices have increased the need for precise and noise-free low-level measurements.
Mechanical Layout Rules for Infinity Probes
Cascade Microtech’s newly developed Infinity probe technology has been designed to not only meet the challenges of high frequency probing but also to meet the demands of stable contact resistance on aluminum pads. Successful high frequency probing also requires that consideration be given to layout and design before design completion and mask fabrication. Failure to observe specific layout requirements can result in the inability to test devices with high frequency probes.
This Application Note focuses on
Recommended cleaning procedures for Infinity Probes
Article Reprints
Assessing Device Rds(on) at Wafer Level
New measurement capability for power device engineers. Reducing the electrical and thermal resistance of the wafer-chuck interface enables full characterization of wafer-level power devices. By Terry Burcham, Technical Support Manager, Cascade Microtech
An SOLR for Accurate Measurement of Orthogonal on-Wafer DUTs
In this paper, we will demonstrate through experimental results how the SOLR approach, which avoids imposing any dependency on the nature of the thru standard itself, provides a superior calibration.
A High Isolation Dual Signal Probe Technology
We describe a new dual signal probe and
vector network analyzer (VNA) calibration standards providing high isolation between signals. Previously existing probes and standards may exhibit high coupling making them unsuitable for use with conventional VNAs. The new design significantly reduces the signal-to-signal coupling of the probes and standards enabling improved calibration and measurement to beyond 40 GHz.
Optimized Impedance Standard Substrate Designs for Dual and Differential Applications
Optimized dual signal Impedance Standard Substrate (ISS) designs are demonstrated. The optimal designs had loopunder grounds, were selected for minimum deviation from lumped element behavior and used mode dampening structures. A comparison of existing design approaches is given and the quality of the designs is illustrated to 50GHz.
Solve complexity issues in 4-port RF designs
For RF measurements on 4-port designs, engineers need to validate and calibrate their RF test system on four ports instead of two. But the addition of two more ports is not just the sum of 2+2. Complexity and problems expand exponentially. Until now,
advanced “probing-tolerant” 4- port calibrations did not exist.
Assess On-Resistance at the Wafer Level
A new test capability enables accurate RdsON measurement prior to packaging of the power MOSFET, reducing development time and manufacturing costs, and allowing device screening.
Power semi testing goes wafer scale
Cascade Microtech Inc. today will field a
characterization system that it says can
shave weeks off the power semiconductor
development cycle. The Tesla probe station allows power semiconductors to be safely tested on the wafer, before the wafer is diced and the chips packaged.
Repeatability and Verification of On-Wafer Noise Parameter Measurements
Noise figure measurements that previously required weeks of effort now can be done in minutes with the NPT18, with improved accuracy.
Microwave Wafer Probing Achieves On-Wafer Measurements Through 18 GHz
On-wafer microwave measurements have become a practical means to improve R&D productivity and fabrication methods in high-speed semiconductor development and production.
Microwave Wafer Probing
Microwave wafer probing allows immediate middle- and post-processing measurement of actual device specifications and element parameters. There is also the added benefit in wafer mapping of those parameters to ferret out process and material related variations
26 GHz Wafer Probing For MMIC Development and Manufacture
Examples of corrected measurements, sources of non-repeatability, the prediction and verifications of the on-wafer impedance standards, and an experiment of the test GaAs FET in several different ways are discussed in this paper.
Extracting More Accurate FET Equivalent Circuits
Some recently developed techniques are discussed for verifying on-wafer microwave calibrations and measurements, quickly and automatically extracting FET equivalent circuits, and using the resulting data.
Improve Accuracy of On-Wafer Tests via LRM Calibration
A new calibration technique, LRM method, combines some of the advantages of SOLT and TRL calibration. Each type of calibration determines a 12 term error model that quantifies systematic errors such as signal leakage, impedance mismatches, and frequency response.
Achieving greater on-wafer S-parameter accuracy with the LRM calibration technique
A new calibration method, LRM, circumvents many of drawbacks of SOLT and TRL calibration, thereby allowing a more accurate and more versatile on-wafer calibration. Also, LRM is simpler to perform because it requires fewer standards.
Accuracy Improvements in Microwave Noise Parameter Measurements
System calibration and DUT S-parameter accuracy are important to the derived noise parameter accuracy, and the use of a vector network analyzer is advantageous. A new algorithm has been implemented which avoids errors caused by different noise source “on” and “off” impedances.
mm-Wave Wafer Probes Span 0 to 50 GHz
The first 0 to 50 GHz wafer probes and planar calibration standards have been realized. Measurements of one-port and two-port active and passive devices demonstrate the accuracy of the approach. Initial FET measurements show the feasibility of verifying mm-wave device theory.
Wideband Probing Techniques for Planar Devices
The progress in the upper frequency capabilities of commercially available GHz coplanar probes parallels progress in solid-state amplifiers. Designers can measure V-band device S-parameters, noise parameters, and power with the same ease as currently achieved at lower frequencies.
Comparison Between Beryllium-Copper and Tungsten High Frequency Air Coplanar Probes
High frequency air coplanar probes using tungsten tips are now available for silicon wafer probing with aluminum pads. A comparative study of the beryllium-copper and tungsten behavior is presented in terms of contact resistance values, stability and reproducibility. Finally, tungsten is demonstrated to be the best material for breaking the aluminum oxide over the pad to enable accurate high frequency probing.
Comparing the Accuracy and Repeatability of On-Wafer Calibration Techniques to 110GHz
Many methods of making corrected S-Parameters measurements are available for on-wafer devices and circuits. This is a comparative study of calibration techniques, presented as most accurate and repeatable for making on-wafer measurements.
Electrical characterization of high pin count surface mount integrated circuit packaging for system optimization
This paper provides information on using Cascade`s microprobing equipment for the modeling of microelectronic circuit packages. These techniques and test measurement equipment will help you collect the most appropriate test data for your package characterization needs.
Enterprise Software for RF Device Characterization
On-Wafer Probes Test Silicon ICs to 110 GHz
Verification of LRRM Calibrations with Load Inductance Compensation for CPW measurements on GaAs Substrates
A series of automated LRRM calibrations with load inductance compensation are performed on alumina coplanar waveguide standards from 1-40GHz, and compared with a benchmark NIST calibration. The calculated error bounds are determined and compared to assess relative accuracy and repeatability of the automated calibrations.
Device Characterization with an Integrated On-Wafer Thermal Probing System
A thermal probe station can minimize set-up and debug time needed to gather S-parameter data over temperature for equivalent circuit extractions and RF circuit designs. One-button calibrations at each measurement temperature yield more accurate FET equivalent circuit temperature coefficients, especially for the parasitic pad capacitances and inductances.
Wafer Probing Fast SONET Devices
Cascade Microtech's Pyramid Probe cards can provide the measurement capabilities for accurately characterizing large volumes of SONET devices in the high-volume production environments. Pyramid probe cards have also been used for high-pin-count analog as well as mixed-signal GaAs integrated circuits (ICs). Customers have enjoyed oeprating lifetimes exceeding 200,000 contact cycles.
Development of Microwave package Models Utilizing On Wafer Characterization Techniques
Offset CPA (CPW-to-package Adapters) standards in conjunctions with an LRM calibration are used to de-embed the response of the adapters from the measured S-parameters. Application of this method is demonstrated by characterizing and modeling surface-mount microwave plastic packages.
Parametric Measurement Issues with 100nm CMOS
Submicron CMOS processes have allowed the production of integrated circuits with millions of transistors. The push towards 0.1 micron scaling makes accurate parametric measurement and modeling essential. Also, an understanding of parameters previously viewed as second order is now critical for high-reliability designs. Deep sub-micron MOS technology has made it necessary to quanitify a number of low-level device currents.
Prober Automates Shielded On-Wafer Tests
The PS21-RF autoprober from Cascade Microtech is the first automatic probe station capable of evaluating on-wafer RF performance in a noise-free environment over the full standard operating temperature range. When coupled with analysis equipment from Hewlett-Packard, the autoprober forms the heart of a measurement system that is capable of complete probing solutions through 110GHz.
On-Wafer Photodiode Measurements with a Lightwave Component Analyzer System
The benefits of on-wafer testing at microwave frequencies will be discussed. Since a general understanding of S-Parameters and microwave measurements is necessary, a brief review of these concepts will be presented. A discussion of the tools necessary for on-wafer optical and microwave measurements, and example of photodiode measurements will be presented.
Impedance Matching Probes for Wireless Applications
The impedance matching solution can be implemented in two distinctly different technologies, air-coplanar and thin-film membrane. Impedance matched probes offer improved load-pull characterization of power, gain and efficiency, and accurate characterization of devices with non-standard impedances.
Multipin Solutions for On-Wafer Parametric Measurements
The low-leakage probe card is critical in evaluation next-generation semiconductor devices, and able to measure MOS subthreshold current/oxide leakage/substrate current /junction leakage, accurately over temperature with little degradation. Devices now can be evaluated using the geometry used in the final chip.
Surface Wave Phenomenon in Wafer Probing Environments
This paper presents measured data showing the presence of surface waves and how they interact with wafer probes and coplanar waveguide transmission lines. Methods for minimizing these interactions are explored and quantified. A discussion of surface wave effects on wafer calibrations is issued.
Verify Wafer Probe Reference Planes for MMIC Testing
To characterize the accuracy of on-wafer MMIC measurements, it is important to understand microwave wafer-probe calibrations over a matrix of planar transmission-line types, sizes, and substrate materials. One of the calibration issues is the electrical lengths of the planar calibrations standards relative to each other and relative to the device under test.
LRM and LRRM Calibrations with Automatic Determination of Load Inductance
Two new techniques are presented to achieve greater accuracy and better repeatability in on-wafer calibration of vector network analyzers. One is a method of determaining an inductance value for the match standard during the calibration process. Another is LRRM, which is a variation of LRM with several possible advantages.
Brochures
EPD - EDGE - Brochure
The EDGE™ Flicker Noise Measurement System is the world’s only fully integrated, noise-immune measurement system that certifies accurate flicker noise measurements from 1 Hz to 30 MHz. The EDGE delivers new levels of certainty to companies that must continue to improve device performance, increase yield, command higher margins and reduce time to market.
Cascade Microtech Services
Worldwide service and support
dedicated to providing the greatest value for every dollar you spend
Elite 300 Product Brochure
Taking the next step in 300mm probing means delivering a probe station that specifically solves the enormous measurement challenges brought on at each advancing technology node. Shrinking geometries, new process materials and increasingly complex designs are all pushing the boundaries of precision electrical
metrology.
M150 Measurement Platform Brochure
The M150 Measurement Platform delivers
Cascade Microtech’s world renowned precision electrical measurement capability in an affordable and flexible platform for characterizing and analyzing wafers, ICs, packages, circuit boards, MEMs, biological structures, and electro-optic devices.
WinCal 2006 Brochure
WinCal 2006 software provides absolute confidence in your RF characterization measurements through the most trustworthy and efficient network analyzer (vna) calibration and systemic error control.
WinCal XE Software Brochure
WinCal XE enhances RF measurement accuracy and productivity through guided system setup, automatic calibration and validation, and other advanced RF measurement tools. Smart system setup and customizable Wizards ensure everyone a correct system setup, reliable VNA calibration, and repeatable data.
Tesla: On-Wafer Power Device Characterization System Highlights
A feature overview of the Tesla On-Wafer Power Device Characterization System
Tesla: On-Wafer Power Device Characterization System Brochure
Tesla is the industry’s first complete system for on-wafer power device characterization. By eliminating the need for time-consuming, in-package characterization or risky in-house test solutions, Tesla delivers unprecedented productivity gains, faster development cycles and a lower cost of test. Now power device manufacturers can take advantage of a complete on-wafer solution for over temperature, low-contact resistance measurements of power devices up to 60A and 3000V.
PureLine Technology Brochure
Cascade Microtech 200mm and 300mm probing systems with PureLine technology dramatically reduce electrical intrusion for noise-sensitive devices and tests – now and for the future.
CMI IMS News 2007
Late-breaking news in high-speed measurement and test. Cascade Microtech's IMS News handout from the IEEE MTT-S International Microwave Symposium, June 2007
New Accessories from Cascade Microtech
Part numbers and product descriptions for the latest Cascade Microtech accessories.
eVue Product Brochure
New probe navigation tools,
next generation digital microscope technology and advanced video processing enable
dramatic productivity increases in device probing and measurement.
Precision Electrical Measurements for Small-Scale Technologies
Since 1984, Cascade Microtech, Inc. has supported the semiconductor
industry by providing probing solutions for its toughest measurement
challenges. Today, semiconductor manufacturers worldwide rely on us
for in-depth applications expertise, world-class service and support, and
the proven ability to provide trusted measurement technology. Our
innovative solutions, combined with our passion for ensuring customer
success, have facilitated massive reductions in integrated circuit (IC)
design cycle times
Multiport/Differential Characterization Solution
The use of differential circuit topologies is becoming increasingly common in a wide range of RF applications. This solution enables on wafer multiport or balanced devices and circuits to be characterized to frequencies as high as 8.5 GHz. This turnkey on-wafer solution includes dual high performance characterization probes, a differential ISS (Impedance Standard Subatrate), an Agilent ENA Series RF network analyzer and Cascade’s probing systems. turnkey solution combines the necessary tools to fully charac
Cascade Microtech's Microprobe Access: Accessories catalog
The premiere edition of Cascade Microtech's microprobing supplies and accessories.
Microwave Device Characterization Solution
The demand for high frequency ICs is being driven by the growth of complex electronic systems with clock rates of >1 GHz (PCs, PDAs, wireless LANs, Bluetooth chips). This turnkey solution combines the necessary tools to fully characterize these leading edge devices and circuits from 45 MHz to 50 GHz.
Millimeter Wave Device Characterization Solution
Leading-edge devices using SiGe, InP and GaAs technologies now operate at frequencies to 110 GHz and beyond. The transition to Silicon Germanium processes allows companies to create powerful new microcommunication devices. Due to increased competition, bringing these devices to market faster, cheaper and with higher performance is now a requirement. This turnkey solution combines the necessary tools to fully characterize these devices from 45 MHz to 110GHz.
MEMS Optical Switch Production Test System
The Series 12000 Switch Resonance (SR) integrates the Cascade Summit 12000 Series wafer probing system and the Polytec Micro-Scanning Laser Vibrometer (MSV) to provide an automated,non-invasive device characterization during the MEMS optical switch manufacturing process. Complete characterization of every MEMS device in an optical switch array is critical to ensure final switch performance. This includes dynamic measurements of each device in its actuated state. The Polytec MSV provides a unique, non-contac
Datasheets
WinCal X Specification Sheet
By design, Cascade Microtech’s WinCal XE™ software provides unprecedented ease-of-use and delivers valuable productivity gains to the complex
task of conducting RF measurements. Right from the start, WinCal XE features a guided system setup complete with customizable Wizards to ensure fast and easy access to reliable VNA calibration and repeatable data.
Unity Probe™ Specification Sheet
Cascade Microtech’s Unity multicontact probe streamlines RFIC engineering test. Leveraging common-sense, test-structure design rules, the build-to-order Unity Probe is a durable and scalable solution that is fast and easy to implement; saving you time, aggravation and money.
EPD - EDGE Specification Sheet
The EDGE™ Flicker Noise Measurement System is the world’s only fully integrated, noise-immune measurement system that certifies accurate flicker noise measurements from 1 Hz to 30 MHz. The EDGE delivers new levels of certainty to companies that must continue to improve device performance, increase yield, command higher margins and reduce time to market.
EPD - DCM-400 Specification Sheet
The DCM-400 submicron DC positioner is the most reliable positioner available for fine feature probing. Robust design, stiffness and precision construction eliminate backlash and provide independent X, Y and Z linear travel. The DCM-400 positioner provides for quick and reliable placement of fine probe tips on submicron targets.
PureLine Datasheet
As your signals and measurement tolerances become ever smaller, signal-to-noise ratio degrades, and "noise headroom" is rapidly becoming a thing of the past. PureLine ensures confidence in your test data from process development through characterization and modeling to long term reliability and failure analysis test.
Tesla: On-Wafer Power Device Characterization System Spec Sheet
Designed specifically for testing power devices on wafer, the Tesla system is engineered to withstand probing levels of up to 3000V and 60A; it provides
triaxial measurements up to 1100V; and supports a measurement temperature range of -55° to 200°C. In combination with Cascade Microtech’s
patented Microchamber™, Tesla features a state-of-the-art chuck to ensure low-contact resistance, while providing a low-noise, fully guarded and shielded test environment.
Elite 300 Specification Sheet
At a glance, you’ll notice its ultra-efficient, ergonomic design. Upon further inspection, you’ll discover exactly why the Elite 300 is essential at 45nm and beyond. Featuring next-generation, Pureline II™ performance, the Elite 300 is the world’s lowest-noise probe station.
Summit DC/CV Parametric Probing Systems: 6- and 8-inch Analytical Wafer Probe Stations
Summit wafer probing systems allow you to access the full measurement range of your parametric test instrumentation. Noise, leakage, capacitance and measurement settling times have been greatly reduced, even when using a 48-pin probe card. Whatever your application: wafer-level reliability, e-test, modeling, or yield enhancement, Summit probe stations assure best-in-the-world measurements.
Summit 6- and 8- inch RF / Microwave Probing Solutions
A complete microwave test solution goes far beyond simply connecting the probes, probe station, and test instrumentation. With Cascade Microtech you get not only precision tools, but the analytical test experience you need to make accurate, repeatable, on-wafer measurements.
Advanced Solutions for On-Wafer MOS CV
Cascade Microtech probe stations fully support today's high-resolution, high-frequency, on-wafer capacitance
measurement requirements. This complete solution includes: precision off-wafer, thermally isolated calibration
standards and reference capacitors, high-frequency cabling and accessories, along with Cascade’s patented
AttoGuard® and MicroChamber® technology. This solution assures unsurpassed on-wafer impedance
measurements.
WinCal 2006 Datasheet
calibration, multiport
eVue Technical and Ordering Information
eVue digital imaging system, avialable in standard and Pro package versions, features new probe navigation tools, next generation digital microscope technology and advanced video processing enable dramatic productivity increases in device probing and measurement.
WinCal XE Technical & Ordering Information
FPM-Series Fine-Pitch Microprobe
The Fine-Pitch Microprobe offers four attenuation options for different requirements- 1x, 10x, 20x, and 100x. A unique ground system provides the low-inductance needed to effectively troubleshoot high-density applications. To minimize loading effects on the circuit or node measured, FPM probes provide as little as 0.02 pF tip capacitance.
ISS Series of Impedance Standard Substrates
Impedance Standard Substrates
(ISS) ensure greater accuracy and better repeatability in on-wafer
calibration of vector network analyzers.
• Precision 2-port, 3-port, and 4-port
network analyzer measurements
• Multiport applications
• Differential applications
Special Purpose Probe, Cryogenic ACP Probe
This custom probe is designed to provide superior mechanical properties at cryogenic temperatures while maintaining solid RF measurement performance. The Air Coplanar® construction provides excellent tip visibility and contact compliance.
40/80 Gb/s High Performance Quadrant Probe technical and ordering information
This special purpose probe is designed to provide wide bandwidth RF connections and simultaneous resonant free power bypass connections for the special needs of high-speed mixed mode IC’s for optical networks. The Air Coplanar construction provides unsurpassed tip visibility and
contact compliance with production-ready ruggedness.
DCP 100-Series Probes Precision DC Coaxial Microprobes
The DCP 100-Series delivers the measurement accuracy needed for advanced on-wafer process and device characterization, as well as state-of-the-art reliability testing. With superior guarding and shielding, these probes overcome the performance limitations of non-coaxial needles.
DCP-HTR High performance DC Probe Holder
The DCP-HTR probe holder delivers fA-level measurement capability from -65°C to 300°C for state-of-the-art reliability testing. Its unique design offers superior guarding and shielding over-temperature, overcoming the high-temperature performance limitations of standard coaxial needles.
RF-1 Microwave Probe Station
The RF-1 Microwave Probe Station provides the ideal general purpose benchtop solution, in a compact, low-cost design. The RF-1 combines precision movement and stability with high value microwave probing features, and accommodates the full range of Cascade’s microwave probing tools.
M150 Measurement Platform Datasheet
The M150 sets a new standard for providing precision electrical measurement capability in a cost-effective, ultra-flexible platform. Its
modular design and broad range of accessories make it the ideal solution for today’s complex analysis and characterization demands that span multiple materials and numerous 150mm measurement applications.
S300 Characterization Probing Systems
The Cascade Microtech S300 probe station sets the measurement standard for 300mm wafer test. Whatever your application: device characterization, wafer-level reliability, e-test, device modeling, or yield enhancement, the S300 with integrated MicroChamber® and AttoGuard™ technology provides the lowest noise, leakage, and residual capacitance. Thus creating a measurement environment to satisfy the accuracy and speed of the most demanding applications. The S300 assures best-in-the-world measurements, now for 3
Backside Wafer Probing Kit for Alessi REL-4800 & REL-6100
The Backside Emission Microscopy Kit extends your stations’ failure analysis capabilities by allowing one station to be configured for both standard front-side probing as well as backside emission microscopy. Changing from standard front-side to backside probing is done quickly and easily, minimizing downtime and maximizing productivity.
200mm Manual and Semiautomatic Probe Stations
The REL-6100 and REL-4800 Series Parametric Probe Stations combine precision sub-micron probing capability with the superior measurement performance necessary for DC/CV analysis. The stations feature sub-micron resolution, precise motion control, and 8-inch travel. Precise, flexible and affordable FA and DC/CV probe stationInnovating Test Technologies®The REL-6100 and REL-4800 Series Parametric Probe Stations Precise, flexible and affordable FA and DC/CV probe station
Summit Series Station Ordering Information
Summit wafer probing systems allow you to access the full measurement range of your parametric test instrumentation. Whatever your application: RF/Microwave, device characterization, wafer-level reliability, e-test, modeling, or yield enhancement, Summit probe stations ensure best-in-the-world measurements.
FPA-Series Fine-Pitch Active Probe
The Fine Pitch Active Probe features Hewlett-Packard’s bipolar/hybrid circuit technology optimized for probing high-density modules. Allows active probing of fine pitch surface mount boards and MCMs. Available as a stand-alone probe or packaged with a dual micropositioner to allow independent positione of the signal and ground probes as small as 25 microns.
DCM-100 Micropositioner Tech & Ordering Info.
Technical and ordering information for the DCM-Series Probe Micropositioner. The DCM-Series Probe Micropositioner is optimized for all DC/CV applications and accepts a variety of Cascade Microtech DC probes.
New Cascade Microtech high frequency cable assemblies
Cascade Microtech introduces a new series of high frequency cables that enhances
the overall compatibility of the cable and probe within the top hat for microchambered probe stations as well as provides key advantages in terms of
reduced EMI/RFI and light leakage.
Infinity Probe Family
The Infinity Probe family sets a new benchmark for the device characterization and modeling community. This revolutionary probe combines extremely low contact resistance on aluminum, copper or gold pads with unsurpassed RF measurement accuracy to give you highly
reliable, repeatable measurements.
FPR-Series Fine-Pitch Resistive Divider probe
The FPR-Series Fine Pitch Resistive Divider Probe allows passive probing of fine pitch surface mount boards and MCMs. It includes a dual micropositioner to allow independent positioning of the signal and ground probes on points as small as 25 microns (1 mil). The low inductance ground path, small capacitive probe tip load, and high bandwidth are essential for accurate measurements of high-speed circuits.
FPC-Series Fixed-Pitch Compliant Probe
The FPC-Series Fixed-Pitch Compliant Probe is a high-frequency, 50-ohm coaxial probe that offers a signal line with either one or two low-inductance fixed-pitch ground contacts. The probe tip structure is lithographically-defined for unsurpassed impedance control, preserving the highest integrity possible in launching and receiving signals from SMT boards, hybrids, and MCMs.
Air Coplanar® Angle Series Probes
Cascade Microtech, the company that made on-wafer high frequency probing possible, introduces a new body style for its Air Coplanar Probe (ACP) series. This innovative body shape maintains the same existing electrical characteristics of the signal path for all probes from DC to 110 GHz, while providing a lower-profile body that has an angled connector at 45 degrees. This new design also allows greater flexibility in terms of integration for some applications
MPH Microprobe Holder Technical and Ordering Information
The MPH-Series MicroProbe Holders provide economical conversion kits for your existing needle-type probe stations not otherwise capable of high-frequency probing. The probe holders are optimized for use with Cascade probes, and also provide convenient mounting for needle probe arrays.
MS1-8 Series Programmable Micropositioners
The MS1-8 motorized programmable RF/microwave positioner is designed for use with the Summit 12000-Series probe stations. Based on the MS1-44, the MS1-8 consists of a bolt-down base and an RF/Microwave probe arm that conveniently fits within the MicroChambered top hat.
MS1-44 Series Programmable Micropositioners
The Alessi MS-Series programmable micropositioners are designed for semiconductor wafer-probing applications on Alessi stations where high accuracy and repeatability are required.