Wafer-Level Reliability (WLR)
With shrinking device geometries, and increasingly complex designs, capturing high quality reliabiilty measurement data is challenging. Wafer Level Reliability (WLR) requires a low-noise environment capable of handling a large temperature range. 
- Broad Thermal range: Probe stations for 200mm and 300mm wafers with full range thermal systems from -65o to 300oC enable measurements that truly stress the reliability of devices over a wide temperature range.
- Probe card support: Modular probe card mounts for Celadon, Aetrium and other popular reliability probe cards
- Large area probe tip viewing: Large area microscope mounts combined with eVue™ digital imaging system provide easy alignment of multi-site probe cards over the entire wafer.
| High temperatures needed for test | 400° C capable thermal systems |
| Multiple simultaneous contact points | High rigidity probe card holders |
| Need precision voltage for TDDB | Electrically quite noise systems and accessories |
| Fast probe card alignment | High-resolution multi-view capability |
