eVue Digital Imaging System
eVue™ digital imaging system enables dramatic productivity gains in semiconductor wafer navigation and testing.
The eVue™ digital imaging system is a revolutionary new microscopy tool optimized for on-wafer test with Cascade Microtech Probe Stations. It radically improves wafer navigation, test setup, and probe contact accuracy through the integration of microscopy, digital imaging, and software automation. By combining new wafer probe navigation tools with next generation digital microscope technology, users can now see, touch, and measure devices far beyond a traditional microscope.
- Quickly navigate and setup tests
- View multiple perspectives of a test device simultaneously
- Simplify over-temperature measurements
- Control probe overdrive and improve data accuracy
Applications
| Failure Analysis | ||
| Internal Node Probing Setup and navigation of sub-micron probe tips take a long time with the need to constantly change microscope objectives and switch between fields of view. Multiple probes tips can not be seen simultaneously – a non-viewed probe tip might lift off the node. Probe tips can be crashed when changing objectives, and moving microscope. Tips are often ‘lost’ using high magnification. |  | eVue Pro Solution: eVue simultaneously displays low, medium, and high magnification (FOV) video of the probe needle, allowing you to quickly “land” the sub-micron tip on a 1-5µm2 pad. Multiple probe tips can be viewed and tracked simultaneously, to ensure all probe tips are contacting pads. |
| Device Characterization and Modeling | ||
| Over Temperature RF Wafer Test Wafer and chuck flatness change with temperature. Tests must be stopped and restarted to reset RF probe overdrive so probe tips will not skate off test pads at different wafer positions. Erroneous test data is collected if contact sensitive devices are probed with non-uniform probe overdrive. Damage to bond pads and devices can occur with excessive probe scrub marks. 30-60 minutes is needed for the thermal chuck to height stabilize (soak time) before starting full wafer test. |  | eVue Pro Solution: Non-uniform probe overdrive is eliminated by optically measuring and applying an accurate map of wafer height (Z-profile) for all test locations and temperatures. Additionally, eVue can optimize wafer contact height “on-the-fly” as chuck/wafer height change during soak time. |
| Process Development/Reliability | ||
| Probe Card Alignment - Process Monitoring Using long or high pin count probe cards, it is difficult to easily align needle tips to pads, because both ends of the card cannot be simultaneously seen with adequate magnification. Card alignment wastes time switching between magnifications and locations. All needles may not have equal contact or spacing on the pads. |  | eVue Pro Solution: eVue's high resolution Multi-View capability displays both ends, intermediate sites and the full card layout – simultaneously. For quick alignment and planarization, eVue eliminates the need to move the microscope or change objectives. |
| Advanced Technology/Research | ||
| Hi-Resolution & Hi-fidelity Color Image Capture High resolution microscope images are needed for management reports, product yield results, and research. Multiple FOV images need to be stitched together to show a “navigation story” (wafer, IC, device/test node). External software is needed for annotations and to convert images to JPEG for reports. Hours can be consumed switching to a high resolution camera. |  | eVue Solution: Image capture and live video modes are integrated in the eVue system (megapixel image/video in Pro package). Annotate, resize, and output images in popular file formats, all from within eVue. Easily capture the navigation story using eVue Pro package Multiple FOV image capture. |
