Application Segments
As devices get smaller, faster and more complex, the measurement challenges increase in complexity. Cascade Microtech answers this challenge with a broad portfolio of on-wafer measurement systems, RF & DC probes, micro probing positioners, microscopes and complete line of accessories. Our systems solve problems in all categories of on-wafer measurements from device and process characterization through failure analysis. Cascade Microtech's deep applications knowledge and world wide service and support infrastructure allows us to partner with our customers in solving some of the most complex on wafer measurement problems.
DC/CV Parameter Extraction for Semiconductor Device Modeling
Scaling of advanced CMOS devices as low as 32 nanometers relies on precision low current and low capacitance measurement capability. To fully characterize device behavior, wafer temperature control from -55ºC to 300ºC is essential. Cascade Microtech's probe stations enable precision measurements below 1fA by reducing noise and leakage significantly. The AttoGuard further enhances measurement performance for both thermal and ambient characterization and can be configured as an extended shield ground for CV or triaxial guard for IV measurements. In addition, Cascade Microtech offers a full range of electrically optimized thermal systems along with it's on-wafer measurement systems.
View: DC/CV Parameter Extraction for Semiconductor Device Modeling
RF Parameter Extraction for Semiconductor Device Modeling
Cascade Microtech’s RF/Microwave test systems include high performance probe stations, high frequency probes up to 220GHz, Impedance Standard Substrates, and calibration software with RF measurement support tools.
View: RF Parameter Extraction for Semiconductor Device Modeling
Flicker Noise Analysis (1/f)
CMOS technology for wireless applications is driving flicker noise and other noise parameter measurements. Noise is induced by external factors making it difficult to find and characterize the corner frequency. This prevents accurate characterization of the intrinsic noise of the device. Our flicker noise probe stations, probes and accessories are designed for low background noise, improved RFI immunity, low conducted and locally-generated emissions.
Multi-port/Differential Probing
The use of differential device architecture is becoming increasingly common in a wide range of RF applications. Cascade Microtech’s turnkey solutions enable on-wafer characterization of multiport or balanced devices and circuits. They include Cascade Microtech’s probe stations, dual probes, differential ISS, and calibration software with advanced 4-port calibration algorythms.
Wafer-Level Reliability (WLR)
With shrinking device geometries, and increasingly complex designs, capturing high quality measurement data is challenging. Wafer Level Reliability requires a low-noise environment capable of handling a large temperature range. Cascade Microtech offers a full portfolio of manual and semi-automatic 200mm and 300mm systems with temperature capability for -55°C to 400°C and support for a broad range of probe cards.
Failure Analysis/Design Debug
Viewing and making electrical contact to sub-micron internal IC circuit features can be challenging. Mechanical stability and precision, flexible and easy application changeover coupled with precision electrical measurement capability, make Cascade systems the right choice for failure analysis.
Signal Integrity / Package Test
Signal integrity analysis in high-speed PCB design is a growing need as digital system designers pursue ever-higher clock and data rates in computer, communications, video and network systems. S-parameter measurements are increasingly becoming part of cable assembly compliance testing of high-speed digital standards. Cascade Microtech enables precision signal integrity measurements such as insertion loss, return loss, and frequency domain crosstalk, with reliable measurement tools optimized for up to 220 GHz.
