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International Symposium on Power Semiconductor Devices and ICs (ISPSD)
Event Details
How InfinityQuad™ Probes Help DICE Characterize Mixed-Signal Devices with Small Pads
Danube Integrated Circuit Engineering (DICE), a radar IC manufacturer in Austria, makes mmW receiver/transmitter ICs for automotive collision avoidance radar applications. These devices have close to 100 connections surrounding a 5 mm2 die, with up to 25 mixed-signal contacts per side, limiting the size of the pads to 80 μm x 80 μm. Read our case study and learn how DICE overcame testing challenges and reduced test times by 50% using InfinityQuad probes. [Download]
Consistent Parameter Extraction for Advanced RF Devices
Pushing device operation frequencies towards the sub-THz range causes serious challenges for conventional device characterization techniques. This application note presents a comparison of SOLT, NIST multiline TRL, and LRRM probe-tip calibration methods for accuracy of measured and extracted figure of merits (FoM) of advanced BiCMOS HBT. A good understanding of possible sources of errors and potential room for improvement at each step are key to increasing the accuracy of device characterization. This paper will show why eLRRM is recommended as an accurate, consistent and easy to implement probe tip calibration method for characterization of advanced high-performance active devices.
N+1-Port SOLT/SOLR Calibration
The calibration solution presented in this document is focused on InfinityQuad™ probes, where the probes are assumed in all four quadrants of the device under test (DUT). It is shown that the proposed N+1-port SOLT/SOLR calibration can calibrate an N-port network of the InfinityQuad placed in four quadrants, using a standardized calibration procedure and standard calibration substrates that are commonly available. Although the inconsistency of the delay can cause measurement uncertainty, it is shown that their effects are likely to be minimal in most practical applications.
Cascade Microtech Reduces Cost-of-Ownership and Delivers Probing Expertise
In a global response to market requirements to reduce the cost-of-ownership while at the same time meeting the ever-demanding complex probing challenges, Cascade Microtech is implementing three new programs to drive down ownership costs and provide customers with increased access to experts in probe technology. Read more ...
Cascade Microtech Improves Yield of Multi-site RF Production Test with New S-Technology Pyramid Probe Cards
S-Technology™ for improved contact physics. S-Technology provides a unique mechanical architecture for Pyramid Probe® cards designed to consistently deliver evenly distributed contact force for solder bump technologies found in today's demanding high-volume production test environments. Read more ...
New Approach to Wafer-level Unattended Over-temperature Test Reduces Test Time and Increases Throughput
Most test plans call for gathering wafer test data over a series of temperatures. Thermally induced drift between probes and pads can result in alignment errors with most wafer probers, even with so-called semi-automatic probers. To maintain electrical contact, the alignment must be corrected at each new temperature. Since most analytical probers are not equipped with probe-to-pad-alignment (PTPA) systems, this alignment must be done manually, increasing process time and limiting test productivity. Read more ...